All digital electronics generate heat through the operation of transistors, which act as switches, stopping electric current or allowing it to flow. In other words, heat is a by-product of power generation. If you don’t get rid of the “extra” heat, the device can overheat and fail. Therefore, electronics components need cooling systems, which are often represented by heat sinks. They are usually made of copper and aluminium plates with high thermal conductivity.
But these metals have a big problem. They are good conductors of electricity. To reduce their electrical conductivity, an electrically insulating oxide or nitride thin layer is made between the metal and the component. But even here there is a disadvantage – poor conductivity of heat.
Scientists have long been trying to find a material to replace the intermediate layer, which would have good thermal conductivity. A group of physicists led by Matthias Mühle (Matthias Mühle) from Europe’s largest association of applied research institutes Fraunhofer Society, as well as their colleagues from the United States. The wand was a diamond.
The physicists noted that their flexible electrically insulating nanomembranes can reduce the heat load of electronic components by a factor of 10, which, of course, will improve the energy efficiency and lifespan not only of the components themselves, but also of the entire device that contains them. Another advantage of such nanomembranes is that when used in charging stations, such as those for electric cars, they can increase charging speeds by a factor of five.
